Pressure oven

产品简介：

The ELLER pressure oven is suitable for low voids and increased adhesive strength requirements in the bonding process, as well as a wide range of applications in the wafer packaging and filling process

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1.Heller has developed Pressure Cure Oven (PCO) or Autoclave to minimize voiding and increase adhesion strength for bonding processes typically used in die attach andunderfill applications. PCO pressurizes air into a rigid vessel and heats with forced convection. When the curing process is complete, the pressure oven automaticallyrelieves its pressure to 1atm and cools.

2. PCO pressurizes air into a rigid container and heats and cools it by forced convection ;

The heater, heat exchanger and blower are located inside the pressure vessel ;

After the curing process is completed, the pressure curing furnace will automatically reduce the pressure to 1atm and cool down .

3. Process specification:

Processing time:	usually 120 minutes or the time specified by the user
Operating temperature:	60℃ ~ 200℃
Maximum temperature:	220℃
Working pressure:	1 bar – 10 bar
Capability value:	24 clips (standard)
Cooling mode:	PCW (17℃ – 23℃)
Cooling water pressure:	25 – 40 psi

Pressure oven

全国服务咨询热线：0512-66389019

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