Fluxless Reflow (Formic Acid)

产品简介：

HELLER Industries has developed fluxless reflow which utilizes Formic Acid (HCOOH) to replace standard flux agents

全国服务咨询热线：0512-66389019

HELLER Industries has developed fluxless reflow which utilizes Formic Acid (HCOOH) to replace standard flux agents. Formic Acid has been shown to be an effective reducing agent in fluxless solder reflow. It eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps. Heller industries can map the formic acid concentration profile and reduce O2 ppm to ~10 ppm for bumping application. Excellent results demonstrated for wafer bumping application and C4 Flip Chip process.

HELLER Fluxless Reflow Features:

• Can use any reflow profile (e.g., tent or soak profile) with formic acid；
• Can adjust formic acid profile in oven in conjunction with thermal reflow profile；
• Includes Formic acid safety system (i.e., sensors/detectors) adheres to industry standards；
• Offers optional Formic acid abatement systems for Green Process Solution；
• Offer optional real time formic acid concentration monitor system；
• Capable of running both formic acid process and flux process （Option）；
• SEMI S2-S8 certified（Option）；

HELLER Fluxless Reflow Oven：

• 13 convection heating zones and 4 convection cooling zones；
• Formic acid delivery system；
• Real time formic acid concentration and O2 PPM measuring；
• Environmental monitoring system and exhaust abatement system for operation safety；

Fluxless Reflow (Formic Acid)

全国服务咨询热线：0512-66389019

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